Samsung needs to carry chips with glass substrate to the market, and quick


In context: Producers are attempting to develop novel chip substrate applied sciences to avoid wasting Moore’s regulation and preserve crunching the Megahertz charges up. Glass is essentially the most promising materials for next-gen substrates Producers ought to begin utilizing them sooner than anticipated – if Samsung can succeed at its ramped-up R&D effort.

In line with rumors from unnamed trade insiders, Samsung has determined to take a position closely within the analysis and growth of glass substrates for chip manufacturing. The corporate plans to carry merchandise to clients by 2026, making a “coalition” of subsidiary organizations to hurry up expertise growth.

The leakers say that three divisions inside the Korean conglomerate – Samsung Electro-Mechanics, Samsung Electronics, and Samsung Show – will develop the brand new glass-based chip substrates. Samsung Electronics will work on integrating semiconductor parts with the brand new substrates, whereas Samsung Show and Electro-Mechanics concentrate on the glass processing half.

The insiders mentioned that Samsung will attempt to leverage a synergic strategy amongst its subsidiaries, leveraging their experience of their respective fields. In the course of the Client Electronics Present 2024, Samsung Electro-Mechanics introduced plans to construct mass-production capabilities for glass substrates by 2026.

Glass substrates can theoretically carry vital enhancements to the chip manufacturing course of. In comparison with conventional natural substrates, glass reveals an enhanced flatness that improves the depth of focus for lithographic processes. The fabric additionally has greater dimensional stability for interconnects and gives greater thermal and mechanical energy.

The fabric might face up to greater temperatures and stress ranges, making chips extra sturdy and resilient even in “harsh” information middle circumstances. The expertise can be splendid for multi-chiplet, system-in-package (SiP) purposes, that are set to grow to be one of many trade’s hottest chip designs. Intel has been creating a glass substrate answer for years, and the corporate not too long ago introduced its plans to launch novel business merchandise by 2030.

Samsung and Intel aren’t the one corporations engaged on the subsequent era of substrate expertise. Japanese producer Ibiden has additionally joined the R&D effort for glass-based designs, whereas South Korean firm SKC has opened a brand new subsidiary (Absolics) to develop new mass manufacturing capabilities. Absolics has already partnered with AMD and different main semiconductor corporations.


Leave a Comment